T-Junction Measurement Development on LED Lighting Device
Abstract: Only 15% - 20% of high power LED’s power changes into light, and the rest becomes waste heat. In order to improve the result of development in high power LED, a measurement system is needed to prove it. Based on the requirement of JESD51-1, a constant environmental temperature is necessary. In this project, we designed a T. E. Cooler Test Board with Thermoelectric Cooling Module, which can be controlled in constant temperature by the T.E.C. Controller, letting the generated heat pass through the LED chip (die) to the T. E. Cooler Test Board without any difficulties. We also put a pressure on the LED by using thermal interface material between LED and T. E. Cooler Test Board when we measure the LED sample. TJ0 is the initial temperature before heater power is applied; TSP (Tempe- rature-Sensitive Parameter) is the voltage drop across a forward biased diode, which is the difference between VF0 and VFSS. VF0 is the initial voltage with measurement current, and VFSS is the voltage in measurement current after high power is removed; K factor is a constant parameter in the same LED. We can use the relationship between TSP and K factor to find out the changes in temperature ∆T. Having these three different parameters helps us to calculate the junction temperature.
文章引用: 赵珍谊 , 林唯耕 , 王鸿博 , 王嘉祥 , 陈柏睿 (2012) LED接端温度量测系统之开发。 可持续能源， 2， 1-7. doi: 10.12677/se.2012.21001
 LED热阻量测标准草案. LED照明标准及质量研发联盟建议标准规范003号, 2008.
 JEDEC Standard EIA/JESD51-1. Integrated Circuits Thermal Measurement Method—Electrical Test Method (Single Semi- conductor Device), 1995.
 张文铧. 以热电致冷器改善热管性能量测平台之不稳定性[D]. 国立清华大学, 2010: 19-24.
 林唯耕, 王本诚, 洪思远, 吕学儒. 以ALL-POLYMER材料制作压阻式压力传感器[A]. 中国机械工程学会第二十七届全国学术研讨会, 2010: DD04-014
 林唯耕, 王鴻博, 王嘉祥. 封装参数对TJ量测之影响[Z]. 台湾热管理协会年会暨技术成果发表会, 2011: B-8.