Silicon Substrate Interconnection Circuit Design
Abstract: According to Moore’s Law, chip integration density continues to increase. Because of limited electrical interconnection physical characteristics, the transmission delay, bandwidth, density and power consumption of the traditional on-chip interconnect technology and other key performance indicators are difficult to be improved, which have become resistance and bottleneck to further enhance the SoC performance. Instead, optical interconnect signal transmission has low loss, high speed, low latency and high bandwidth density advantages. Therefore, optical interconnection technology has potential advantages in the application of SoC. This paper describes the implementation of the simple optical interconnection circuit under the standard CMOS process and the basic light principle light of light-emitting device. Silicon light source plays an important role in the interconnection; the paper made a focus on the silicon light-emitting, and reviewed the last few years’ research about silicon light source. Based on previous research, we design a MOS tube light-emitting device, and the electrical and optical characteristics of the device simulation and analysis. Based on these results, we design a preliminary silicon chip interconnect circuit which may play an important role in future optical interconnects.
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