集成电路动态老化测试系统中高速驱动板设计
Design of High-Speed Driving Board for Integrated Circuit of Burn-In Test System
作者: 曾 榕 * , 张福洪 , 楼津甫 ：杭州电子科技大学通信工程学院，杭州;
关键词: 集成电路； 动态老化； 驱动板； 现场可编程逻辑门阵列； Integrated Circuit； Dynamic Burn-In； Driving Board； FPGA
摘要:
随着大规模集成电路生产技术的迅猛发展，多引脚封装的芯片、大容量的存储器及大规模嵌入式微处理器的广泛应用，国内现有的集成电路动态老化测试系统已不能满足需求。该文针对FPGA/CPLD集成度高、设计灵活等优点，设计并实现了一种应用于新一代动态老化系统的高速驱动板系统。该系统以Altera公司的MAXII系列CPLD芯片EPM570T144I5N为核心。通过FPGA/CPLD软硬件平台验证，该系统各个模块均工作正常，并能满足驱动能力的需求。
Abstract: With the rapid development of production technology for large-scale integrated circuits, applica-tions of multi-pin package chip, large capacity memory and large scale of embedded microprocessor are more and more widely used. Domestic integrated circuit of dynamic burn-in system has been unable to meet the demand. In this paper, taking advantages of FPGA/CPLD high integration, flexible design, etc., it designs and implements high-speed driving board system applied in a new generation of dynamic burn-in system. The system takes the EPM570T144I5N of MAXII series chip in Altera Company as the core. Through the verification of FPGA/CPLD hardware platform, each module of the system works normally and can meet the requirements of driving ability.
Abstract: With the rapid development of production technology for large-scale integrated circuits, applica-tions of multi-pin package chip, large capacity memory and large scale of embedded microprocessor are more and more widely used. Domestic integrated circuit of dynamic burn-in system has been unable to meet the demand. In this paper, taking advantages of FPGA/CPLD high integration, flexible design, etc., it designs and implements high-speed driving board system applied in a new generation of dynamic burn-in system. The system takes the EPM570T144I5N of MAXII series chip in Altera Company as the core. Through the verification of FPGA/CPLD hardware platform, each module of the system works normally and can meet the requirements of driving ability.
文章引用: 曾 榕 , 张福洪 , 楼津甫 (2014) 集成电路动态老化测试系统中高速驱动板设计。 电路与系统， 3， 53-58. doi: 10.12677/OJCS.2014.34009
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