Failure Analysis on Interfacial Slipping in a
Abstract: As far as the basic structure of thin film/substrate commonly used in flexible electronic devices and thermal barrier coatings is concerned, when the film is very thin, it can be found that the failure modes of interface in a film/ substrate structure are significantly different from those of macroscopic scale, namely, a new interface failure, slipping failure, which is observed in experiment research. Considering this phenomenon, the failure model of interfacial slip- ping is provided. Analysis is performed to obtain the energy release rates and stress intensity factors to study the failure mechanism of this structure. The relationships between energy release rates, stress intensity factors and film-substrate thickness ratio are studied. Theoretical results coincide well with the experimental phenomena. Thus, the present solu- tions can be used in structure design of flexible electronics.
文章引用: 戴隆超 , 龚俊杰 , 顾 乡 (2013) 薄膜与基体间的界面滑移破坏。 机械工程与技术， 2， 113-117. doi: 10.12677/MET.2013.24022
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